The products could be applied to multiple scenarios including optical access, home network connectivity, home gateway, set-top-box, and dongle. It can support a variety of middleware, advanced CAS(conditional access systems), DRMS (digital rights management systems), and Linux, Android and TVOS operating systems.
Hi3751V551 with Cortex A73 CPU high performance, can support other applications running smoothly in far-field voice scenarios.
HiSilicon officially announced the collaboration with TCL. Powered by HiSilicon’s the most cutting-edge technology chipset Hi3751V811, TCL unveil series high-end 75” X10 product in the spring new product launch conference. The purpose of X10 IMAX 8K is to build 8K private cinemas for end users
HiSilicon release latest Hi3751V35x series targeting in Full-HD smart TV market.
HiSilicon Launches New Generation of ISP and industry leading H.265 Video Encoder Chipset Hi3518EV300 to Capture New Markets
With the theme of “8K+AI | Empowering Industry”, HiSilicon will share with you it range of AI enabled camera devices and solutions, that cover a wide range surveillance applications from 8K to 1080P. A number of application demos that cover key market segments for Smart City and Smart Home will be on show
HiSilicon will release smart home chipset solution with full-scenarios, low power consumption and high-performance, including STB, Camera, TV, Connection at the BroadcastAsia 2019(BCA2019) exhibition in Singapore. HiSilicon has rich smart home solutions, covering various application scenarios of smart home and addressing the pain points of smart home
"Smart 8K, a New Chapter" HiSilicon demonstrate 8K solution in UHD Forum 2019 hosted by MIIT (Ministry of Industry and Information Technology), NRTA (National Radio and Television Administration), CMG (Central Media Group).
Huawei announced that it has shipped 20M NB-IoT chips since launching the first Boudica 120 product in 2017.Huawei also announced that the next generation Boudica 200 will be released in 2020, supporting 3GPP R15 and onward evolution and higher system integration. Security performance will also be improved to address increasing industry concerns around IoT security.
Hisilicon officially launched next generation 4K panel display driver (TCON) chipset Hi3231V53x series.
Recently, Huawei Technologies Co., Ltd. collaborates with Datang Mobile Communications Equipment Co., Ltd. on 5G NR Interoperability and Development Testing (IODT) in 3.5 GHz band and 2.6GHz band based on 3GPP Release 15 specifications by using Balong 5000, dedicated to accelerating the commercial deployment of NR in 2019. This is the first batch of interoperability testing between 5G commercial base stations and terminal manufacturers from different factories in China.
[March 4, 2019] Huawei and Anritsu announced a significant progress in the joint commissioning on 5G conformance testing. With the help of the Anritsu's conformance test system, Huawei 5G device chipset Balong 5000 is the industry's first to complete the 5G radio frequency (RF) conformance tests in both non-standalone (NSA) and standalone (SA) modes. This giant leap significantly shortens the development period of the SA networking mode and quickens its trial and official commercialization, further narrowing the gap with the NSA networking mode.
HiSilicon officially announced the collaboration with SHARP, one of the World’s largest and leading TV corporation. With HiSilicon’s most cutting-edge technology in chipset Hi3751V811, SHARP unveils the 2nd generation AQOUS 8K Smart TV 80, 70 and 60 series, supporting all state-of-the-art HDRs.