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HiSilicon Release New Far-field Voice Solution

Hi3751V551 with Cortex A73 CPU high performance, can support other applications running smoothly in far-field voice scenarios.

HiSilicon Empowers TCL to Unveil 8K Smart TV with Hi3751V811 chipset solution

HiSilicon officially announced the collaboration with TCL. Powered by HiSilicon’s the most cutting-edge technology chipset Hi3751V811, TCL unveil series high-end 75” X10 product in the spring new product launch conference. The purpose of X10 IMAX 8K is to build 8K private cinemas for end users

HiSilicon release latest FHD Smart TV SoC Hi3751V35x Series

HiSilicon release latest Hi3751V35x series targeting in Full-HD smart TV market.

HiSilicon Launches New Generation of ISP and industry leading H.265 Video Encoder Chipset Hi3518EV300 to Capture New Markets

HiSilicon Launches New Generation of ISP and industry leading H.265 Video Encoder Chipset Hi3518EV300 to Capture New Markets

IFSEC Invitation: 8K+AI Empowering Industry

With the theme of “8K+AI | Empowering Industry”, HiSilicon will share with you it range of AI enabled camera devices and solutions, that cover a wide range surveillance applications from 8K to 1080P. A number of application demos that cover key market segments for Smart City and Smart Home will be on show

HiSilicon Provide Continuous Enablement for Smart Home with Series Chipset Solutions

HiSilicon will release smart home chipset solution with full-scenarios, low power consumption and high-performance, including STB, Camera, TV, Connection at the BroadcastAsia 2019(BCA2019) exhibition in Singapore. HiSilicon has rich smart home solutions, covering various application scenarios of smart home and addressing the pain points of smart home

HiSilicon demonstrate 8K solution in UHD Forum 2019

"Smart 8K, a New Chapter" HiSilicon demonstrate 8K solution in UHD Forum 2019 hosted by MIIT (Ministry of Industry and Information Technology), NRTA (National Radio and Television Administration), CMG (Central Media Group).

Huawei announce the next generation Boudica 200 will be released in 2020

Huawei announced that it has shipped 20M NB-IoT chips since launching the first Boudica 120 product in 2017.Huawei also announced that the next generation Boudica 200 will be released in 2020, supporting 3GPP R15 and onward evolution and higher system integration. Security performance will also be improved to address increasing industry concerns around IoT security.

Hisilicon releases latest UHD product series supporting 4K large-screen display applications

Hisilicon officially launched next generation 4K panel display driver (TCON) chipset Hi3231V53x series.

Huawei Balong 5000 and Datang Complete 5G NR Interoperability and Development Testing

Recently, Huawei Technologies Co., Ltd. collaborates with Datang Mobile Communications Equipment Co., Ltd. on 5G NR Interoperability and Development Testing (IODT) in 3.5 GHz band and 2.6GHz band based on 3GPP Release 15 specifications by using Balong 5000, dedicated to accelerating the commercial deployment of NR in 2019. This is the first batch of interoperability testing between 5G commercial base stations and terminal manufacturers from different factories in China.

Huawei Balong 5000 enables Anritsu to be the industry's first to complete the 5G radio frequency conformance test


[March 4, 2019] Huawei and Anritsu announced a significant progress in the joint commissioning on 5G conformance testing. With the help of the Anritsu's conformance test system, Huawei 5G device chipset Balong 5000 is the industry's first to complete the 5G radio frequency (RF) conformance tests in both non-standalone (NSA) and standalone (SA) modes. This giant leap significantly shortens the development period of the SA networking mode and quickens its trial and official commercialization, further narrowing the gap with the NSA networking mode.

HiSilicon Empowers SHARP to Unveil the 2nd Generation AQOUS 8K Smart TV Series with Hi3751V811 Inside

HiSilicon officially announced the collaboration with SHARP, one of the World’s largest and leading TV corporation. With HiSilicon’s most cutting-edge technology in chipset Hi3751V811, SHARP unveils the 2nd generation AQOUS 8K Smart TV 80, 70 and 60 series, supporting all state-of-the-art HDRs.

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